1. ʻO Cob kekahi o nā kukui kukui LED. ʻO Cob ka pōkole o ka chip ma luna o ka moku, ʻo ia hoʻi, ua hoʻopaʻa pololei ʻia ka chip a hoʻopaʻa ʻia ma ka substrate holoʻokoʻa, a ua hui pū ʻia nā pahu N no ka hoʻopili ʻana. Hoʻohana nui ʻia ia e hoʻoponopono i nā pilikia o ka hana ʻana i nā LED mana kiʻekiʻe me nā ʻāpana haʻahaʻa haʻahaʻa, hiki ke hoʻopuehu i ka hoʻopau ʻana o ka wela o ka chip, hoʻomaikaʻi i ka māmā māmā, a hoʻomaikaʻi i ka hopena o nā kukui LED; ʻO ke kiʻekiʻe o ka cob luminous flux he kiʻekiʻe, haʻahaʻa ke kukui, a palupalu ke kukui. Hoʻopuka ʻo ia i kahi ʻili māmā i puʻunaue like ʻia. I kēia manawa, hoʻohana nui ʻia i nā ʻōpuʻu, nā kukui, nā kukui iho, nā kukui fluorescent, nā kukui alanui a me nā kukui ʻē aʻe;
2. Ma waho aʻe o ka cob, aia ka SMD i ka ʻoihana kukui LED, ʻo ia ka pōkole o nā mea i kau ʻia ma luna, ʻo ia hoʻi, ʻo nā diodes māmā i kau ʻia ma luna o ka ʻili he ʻāpana kukui-emitting nui, hiki ke hiki i 120-160 degere. Ke hoʻohālikelike ʻia me ka pāpaʻi plug-in mua, loaʻa iā SMD nā hiʻohiʻona o ka hana kiʻekiʻe, ka pololei maikaʻi, ka haʻahaʻa haʻahaʻa haʻahaʻa hoʻopunipuni, ke kaumaha māmā a me ka leo liʻiliʻi;
3. Eia kekahi, ʻo ka mcob, ʻo ia hoʻi, muilti chips ma luna o ka moku, ʻo ia hoʻi, multi surface integrated packaging, he hoʻonui i ke kaʻina hana cob packaging. Hoʻokomo pololei ʻo Mcob packaging i nā kīʻaha i loko o nā kīʻaha optical, ka uhi ʻana i nā phosphors ma kēlā me kēia puʻupuʻu a me ka hoʻopau ʻana i ka hāʻawi ʻana a me nā kaʻina hana ʻē aʻe. No ka puka ʻana mai o ka mālamalama, ʻoi aku ka nui o nā puka māmā, ʻoi aku ka kiʻekiʻe o ka māmā. ʻOi aku ka kiʻekiʻe o ka pono o ka mcob low-power chip packaging ma mua o ka pahu kiʻekiʻe. Hoʻokomo pololei ia i ka chip ma luna o ka wela wela o ka substrate, i mea e pōkole ai ke ala hoʻoheheʻe wela, e hōʻemi i ka pale ʻana i ka wela, e hoʻomaikaʻi i ka hopena wela, a e hoʻemi pono i ka mahana hui o ka puʻupuʻu kukui.
Ka manawa hoʻouna: Iune-23-2022