Umthombo wokukhanya

1. UCob ungomunye wokulungiswa kokukhanya kwe-LED. I-COB yisifinyezo se-chip ebhodini, okusho ukuthi i-chip iboshwe ngokuqondile futhi ifakwe kuwo wonke ama-substrate wonke, futhi ama-chip ahlanganiswe ndawonye ukuze afakwe. Isetshenziselwa ikakhulukazi ukuxazulula izinkinga zokukhiqiza amandla aphezulu aholwa ngama-chips anamandla aphansi, angahlakaza ukushiyeka kokushisa kwe-chip, athuthukise ukusebenza kahle kwezibani, futhi athuthukise umphumela ogqamile wamalambu aholwa; Ubuningi be-cob buminous flux buphezulu, ukukhanya kuphansi, futhi ukukhanya kuthambile. Kukhipha indawo ekhanyayo evamile. Njengamanje, kusetshenziswa kabanzi kuma-bulbs, ama-spotlights, phansi phansi kwezibani ze-fluorescent, amalambu asemgwaqweni namanye amalambu;

2 Uma kuqhathaniswa nokupakishwa kwasekuqaleni kwe-plug-in, i-SMD inezimpawu zokusebenza kahle okuphezulu, ukunemba okuhle, isilinganiso esiphansi sokudanda okuphansi, isisindo esikhanyayo nevolumu elincane;

3. Ngaphezu kwalokho, i-MCOB, okungukuthi, ama-Muilti chips ebhodini, okungukuthi, ukufakwa okuhlanganisiwe okuhlanganisiwe, ukunwetshwa kwenqubo yokupakisha ye-COB. Ukupakishwa kwe-MCOB ngqo kubeka ama-chip ku-Cups Optical Cups, ama-phosphors e-chip ngamunye kanye nokuqedela ukusabalalisa kanye nezinye izinqubo eziholwa yi-Chip Chip zigxile endebeni. Ukwenza ukukhanya okwengeziwe kuphume, izitolo ezikhanyayo eziningi, zikhuphuka ukusebenza kahle. Ukusebenza kahle kwe-MCOB Low-Power Chip Packaging ngokuvamile kuphakeme kunaleso sokupakishwa kwe-chip ephezulu. Ibeka ngqo i-chip ku-metal substrate Heat link, ukuze incibilike ukushisa kwendlela yokushisa, yehlise ukumelana okushisayo, ukuthuthukisa umphumela wokushisa ukushisa, futhi unciphise ngempumelelo lokushisa kwe-junction, bese unciphisa ngempumelelo ukufudumala kwe-junction ye-chip eholwa ukukhanya.